Monday, December 5, 2022

BGA Sphere Offering High Thermal Impact Reliability

By Sharad Bhowmick

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PF918-S from SHENMAO America is a High Thermal Impact Reliability BGA Sphere. It is a Lead-Free BGA Sphere that offers a higher tensile strength performance that is up to 1.4 times higher than the typical SAC305 alloy while having a similar range of melting points. It also offers the same reflow profile making it a perfect upgrade over the existing SAC305. It provides better mechanical shock, tensile strength and thermal cycling performances than typical solder alloys such as SAC305 and SAC405.

Solder Spheres in Ball Grid Array (BGA) packages are used to provide the electrical and mechanical connection between the component and the board assembly. These are used for the BGA package since all the contact is extremely small in size and are available at the bottom of the package. In this type of soldering the solder balls or spheres are melted using a hot gas at temperatures over 400° C (750° F). There is another type of packaging called the CSP package, which has smaller balls. The larger balls of BGA packaging allow for better distribution of the gas at the bottom of the package.

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According to the company, the BGA sphere has been made with Sn/Ag4.0/Bi3.0 alloy that is designed with high thermal impact reliability for long-service life electronic products with high-reliability requirements. The lead-free BGA sphere can increase thermal reliability performance by a minimum of 30 per cent. It provides better mechanical shock, tensile strength and thermal cycling performances than typical solder alloys such as SAC305 and SAC405. Due to its excellent thermal cycling reliability performance, the BGA sphere from SHENMAO is suitable for soldering high-power components and advanced IC packages which include wafer-level chip scale packages (WLCSP) with high thermal reliability requirements. It is also suitable for soldering components used in harsh environments such as for automotive devices.


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