Monday, February 26, 2024

Next-Generation 3D Solder Paste Inspection

By Nidhi Agarwal

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Test Research, Inc. has launched the TR7007Q SII, setting new industry benchmarks in speed, precision, and seamless data integration.

3D SPI

Test Research, Inc. (TRI), the electronics manufacturing industry’s test and inspection systems provider, have launched the TR7007Q SII, a state-of-the-art 3D Solder Paste Inspection (SPI) system designed to maximize production efficiency. The company claims that the 3D SPI system, with its rapid platform, offers inspections up to 50% quicker than its predecessors, providing manufacturers with unmatched efficiency. Boasting a 9.8 μm high-resolution 21 MP camera ensures heightened accuracy and stability, suitable for various industries. Its versatility gives dependable and exact outcomes and adeptly inspects Bumps, Flux, Mini LED Solder, and Bare Boards.

The press release says the 3D SPI’s enhanced accuracy and stability ensure meticulous solder measurements and reduce false calls, promising consistent inspection results. The SII, equipped with a broad spectrum light system and coaxial lighting, delivers superior contrast, unparalleled clarity, and evenness, markedly boosting detection rates. The Smart 3D SPI solutions ease data communication between the production line and the chosen Manufacturing Execution System (MES), facilitating data traceability in a connected factory environment. 

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Some of the key specifications of 3D SPI include:

  • Imaging Method: Stop-and-Go Imaging
  • Camera: 21 Mpix
  • Imaging Resolution: 9.8 μm
  • Lighting: Wide Spectrum 2D Lights (RGB+W), Coaxial Lighting
  • Field of View: 50.30 x 40.24 mm
  • 3D Technology: 4-way Digital Fringe Pattern
  • Imaging Speed: Up to 2.6 FOV/sec
  • Height Resolution: 0.4 μm
  • Max. Solder Height: 420 μm
  • WxDxH: 1000 x 1480 x 1650 mm
  • Weight: 795 kg

The 3D SPI platforms support seamless data interchange, accommodating the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX standards.

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