A low-voltage system detects insulation degradation and supports reliability testing of semiconductor packages and materials.
ESPEC CORP. has launched the AMI-SPM Low-Voltage Insulation Reliability Evaluation System to detect early signs of insulation degradation in advanced semiconductor packages. The system measures insulation resistance and leakage current at voltages of 10 V or less, helping engineers evaluate the reliability of fine wiring, new insulation materials, and emerging package structures.
The system is designed for advanced package development, where finer wiring, new dielectric materials, and increasingly complex structures are being adopted to support higher speeds and greater component density. These changes can make early signs of insulation failure increasingly difficult to detect, creating a need for more sensitive resistance measurements.
The AMI-SPM applies low-voltage stress close to the conditions used by advanced packages during operation. Its measurement capabilities allow engineers to identify small leakage-current changes and resistance variations that can indicate insulation degradation before dielectric breakdown occurs.
The system can also be integrated with ESPEC’s Highly Accelerated Stress Test (HAST) Chamber for accelerated reliability testing. Its measurement system can monitor small leakage currents and resistance changes during tests such as biased HAST (b-HAST). The integration automates operations from test initiation through completion, reducing manual work during reliability evaluations.
A built-in statistical analysis function further supports testing. Measurement data is incorporated in real time, allowing engineers to perform Weibull analysis and other statistical analyses while a test is running. Previously, data had to be collected after testing and processed separately. Real-time analysis allows engineers to monitor data trends during testing, assess results earlier, and reduce the workload after testing.
Click here for the original announcement.
