ROCKA Solutions has developed its own SMT Stencil Clean Roll. Today, customers have many variables on the SMT workfloor. With different printer brands and models, each printer has its own tube specs, diameter, notches, slots, etc.; however, the company offers product customization to customize two variables in one part number, which helps to decrease part number errors.
The SMT Stencil Clean Roll is used to remove solder paste residues or other viscous materials allocated into the stencil apertures or stencil contact side surface. Based on the material complexion, this stencil paper is capable of working with ultra-fine pitch apertures, improving cleaning cycle time due high absorption and paper texture allowing better vacuum performance. The stencil paper roll material contains a strong tensile strength, high-absorbency with strong performance. Paper material is made of hydraulicy interlaced fibers with no chemical bonding 100% PLP. Features of the SMT Paper Roll include plastic tubes, high absorbency, high tensile strength, liquid absorption 28 second/5cm, 330g water per 1m2.
Additional advantages include the ability to work with all stencil technologies including nano-coated stencil foils, better solvent usage, which provides an excellent solvent application along the stencil surface, good performance with all developed cleaning solvents including IPA and better solder paste removal, increasing PCBs processed during the cycle.