Precision Materials Enable Advanced 5G Circuits

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The new, fast 5G mobile radio operates at frequencies in the range of 28 Gigahertz and higher. For such a sophisticated technical infrastructure to work smoothly, the use of very special materials is necessary in base stations and terminals. They must not interfere with the highly sensitive electronic circuits and must not distort or attenuate the signals. With its RO4835T laminates and RO4450T bonding materials, Rogers Corporation serves this fast-growing market. 

Rogers’ RO4835T glass-fiber reinforced, ceramic-filled laminates are low-loss materials available in thicknesses of 2.5, 3.0 and 4.0 mil (63.5, 76.2 and 100 micron). They are ideal for use as an essential element of the internal structure of 5G hybrid multi layer PCBs and similar circuits in the millimetre wave range. These laminates can be combined with other materials to provide the many complex functions required by 5G wireless base stations. This applies to all components of such systems, including power supply, signal control and signal transmission.

With its RO4450T bonding materials – available in 3, 4 and 5 mil thicknesses (76.2, 100 and 125 microns) – Rogers is supporting the construction of these 5G hybrid multilayer circuits. These fiberglass-reinforced and internally ceramic-coated films complement the range of different materials used to build these hybrid circuits – including Rogers’ RO4835T and RO4000 laminates. In addition, Rogers CU4000 and CU4000-LoPro films ensure that electrical and electromagnetic specifications are met precisely in numerous 5G hybrid multilayer circuits. 


 

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