This new water soluble flip-chip flux addresses issues with the tiny semiconductor chips assembly process.
Indium Corporation has launched WS-910, a water-soluble flip-chip flux developed for next-generation semiconductor packaging. This solution is designed in addressing increasing demands in small scale chips and complex assembly processes.
Semiconductor packaging is the process of enclosing a silicon chip in a protective case that allows it to connect electrically and thermally to the outside world, and flux is used during this process to remove oxidation and ensure strong, clean solder joints when attaching the chip to the package or substrate.
This flux offers residue removal, making it compatible with both moulded and capillary underfill applications. Its high tackiness makes the large die remain in place during reflow, enabling high yield and stability in manufacturing environments.
Key features:
- Promotes excellent solderability onto a wide range of surfaces
- Ensures consistent yields through consistent dipping performance over extended periods
- Excellent cleaning with pure deionized water at room-temperature
- Pb-free applications and suitable for all high-Sn solders
- Compatible with a wide variety of conventional ultrafiltration and modified ultrafiltration.
Flip-chip flux is positioned as a reliable choice for applications involving warped or thin substrates, as well as fine-pitch, high input/output (I/O) count designs, offering control over the process and cleanliness.
