As solar and storage systems scale, power chips are becoming the bottleneck. This design approach aims to remove that limit. Read on…
Designers of solar inverters and industrial energy storage systems face growing pressure to deliver higher power density, better efficiency, and stable operation under high voltage and current. Magnachip Semiconductor has introduced a new series of 650V and 1200V IGBTs built to handle higher loads in compact designs while improving reliability in demanding operating conditions.
The discrete IGBTs increase current capacity by shrinking the internal cell pitch compared to the previous generation, allowing more current to flow within the same chip area. At the same time, improvements in Reverse Bias Safe Operating Area (RBSOA) strengthen device stability during high-voltage and high-current switching, reducing the risk of failure in harsh operating environments. These features directly target the reliability and efficiency limits faced by inverter and ESS designers.
The devices are available in standard TO-247 and high-capacity TO-247 Plus packages, giving system designers flexibility to balance power handling, thermal performance, and layout constraints. The product range supports a wide span of applications, from residential solar inverters to large industrial systems reaching up to 150 kW.
The new generation IGBTs use advanced field-stop trench technology with refined design and process control. By reducing the cell pitch by about 40%, the devices deliver higher current density without increasing die size. RBSOA has been improved by more than 30%, extending safe operating margins and improving long-term reliability across a wider range of power applications.
To further address rising power and efficiency demands, the company plans to expand the lineup in the first half of 2026 with high-current 650V devices rated up to 150A, new 750V products, and a TO-247-4Lead package that includes a Kelvin pin to improve switching efficiency. These additions aim to support next-generation inverter and energy storage designs moving toward higher capacity, higher efficiency, and tighter system integration.
“This new generation IGBT series enhances efficiency and reliability through refined process technologies,” said Hyuk Woo, CTO of Magnachip. “Building on our market-proven technology and production capabilities, we will continue to expand our solution lineup to better address diverse customer needs.”
