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Location: Bengaluru
Company: TE Connectivity
Responsibilities:
- Design high-speed PCBs from schematic handoff through manufacturing release.
- Develop PCB stack-ups, placement strategies, and routing solutions, and perform pre-layout feasibility analysis.
- Collaborate with global engineering teams to deliver robust and manufacturable PCB layouts.
- Generate fabrication, assembly, and release documentation.
- Support prototype builds and coordinate with PCB fabrication and assembly suppliers.
- Create and maintain PCB libraries and footprints in compliance with IPC standards.
Candidate Desired Profile:
Qualifications:
- Bachelor’s degree in Electrical, Electronics, or related Engineering discipline.
- Proven experience in PCB design, manufacturing, and assembly.
- Strong expertise in multilayer PCB layout, stack-up design, and high-speed PCB development.
- Knowledge of PCB manufacturing processes, SMT/PTH technologies, IPC standards, and fabrication requirements.
- Proficiency with Altium Designer, Cadence Allegro, and AutoCAD.
- Ability to independently deliver PCB designs from concept through Gerber release and support supplier engineering queries.
- Excellent communication, problem-solving, and collaboration skills.
Preferred Qualifications:
- Experience with high-speed digital, RF, or mixed-signal PCB designs.
- Knowledge of Signal Integrity (SI) and Power Integrity (PI) principles.
- Familiarity with CAM350, PDMLink, and ECR/ECN processes.
- Experience with connectors, cable assemblies, and PCB manufacturing optimisation.
- Altium or Allegro scripting and automation experience is a plus.
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