Surface Mount Capacitors For High-Density Power Applications By KEMET

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  • The company’s high-density packaging technology enables creation of a surface mount chip for both high-density packaging and high-efficiency applications
  • Delivers thermal stability and mechanical robustness with low-loss

KEMET has further strengthened its power conversion solutions by extending its KC-LINK range using KONNEKT high-density packaging technology for meeting the growing demands of fast-switching wide bandgap (WBG) semiconductors, EV/HEV, LLC resonant converters and wireless charging applications.

This technology combines KC-LINK’s robust C0G Base Metal Electrode (BME) dielectric system with KONNEKT’s innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution that is well-suited for both high-density packaging and high-efficiency applications, producing up to four times the capacitance compared to a single multi-layer ceramic capacitor. These components are ideal for DC-DC converter market in aerospace, medical and automotive applications.

Robust and stable

High mechanical robustness allows KC-LINK capacitors with KONNEKT to be mounted without the use of lead frames. This design provides extremely low effective series inductance (ESL), resulting in an increased operating frequency range and miniaturization. Capacitors utilizing KONNEKT technology can be mounted in a low-loss orientation to increase their power handling capability further.

By combining KEMET’s Class 1 C0G dielectric system with KONNEKT technology, a low-loss and low-inductance package capable of handling extremely high ripple currents with stable capacitance versus DC voltage and capacitance versus temperature is offered.

An operating temperature range of up to 150 degrees Celsius allows the capacitor to be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling.

“The low ESR of KC-LINK capacitors results in best-in-class ripple current capability,” said Dr John Bultitude, KEMET Vice President and Technical Fellow. “Combined with KONNEKT technology, this solution delivers thermal stability and mechanical robustness through increased efficiency by combining multiple capacitors into a single high density, ultra-low loss package.”

According to a report by Business Insider, the global DC-DC converter market is expected to grow at a CAGR of 17.5 per cent from 2019 to 2025 and reach US$ 22.4 billion by 2025.

KEMET’s KC-LINK range with KONNEKT technology is now available via KEMET distributors in commercial-grade with tin termination finish. It is Pb-Free, RoHS and REACH compliant.


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