Based on Time of Flight (ToF) technology, the new 3D sensor provides high-quality 3D depth data capture and mapping
Gaming, virtual e-Commerce and 3D online education are some of the Augmented Reality (AR) applications that incorporate three-dimensional depth sensors. As they allow a seamless connection between the real with the digital world and provide many advantages, these technologies are strongly demanded.
As per predictions, the market for the 3D sensor in smartphones for rear side cameras is expected to grow up to more than 500 million units per year until 2024.
Therefore, a 3D depth sensor based on the Time of Flight (ToF) technology has been developed by Infineon Technologies and pmdtechnologies, offers a wider spectrum of innovative consumer usability.
The new chip allows the integration into miniaturised camera modules, accurately measuring depth in short and long-range for Augmented Reality (AR) while meeting low power consumption requirements with more than 40 per cent power saving on the imager.
Long-Range Photography and AR
Due to its flexible configurability, the new REAL3 ToF sensor enables differentiated camera performance in a wide variety of ranges, light conditions and use cases while saving battery’s life in mobile devices. For various applications, the new sensor provides techniques like real-time augmented reality, long-range scanning, small object reconstruction, fast low power autofocus and picture segmentation.
Effects such as background blur in videos and pictures from moving scenes are easily enabled without the need for post-photography processing and regardless of ambient light conditions.
Furthermore, seamless augmented reality sensing experiences allow for high-quality 3D depth data capture up to a distance of 10 metres, without losing resolution in the shorter range. Always-on applications such as mobile AR gaming can greatly benefit from the small power budget required by the new sensor and provides users with longer playtime than ever. For applications such as the 3D scanning for room and object reconstruction or 3D mapping for furniture planning and other design applications, the sensor allows doubling the measuring range beyond the current solution in the market.
“The latest 3D image sensor enables a new generation of applications”, says Philipp von Schierstaedt, Senior Vice President Infineon Technologies AG. “It aims to create most immersive and smarter AR experiences as well as better photography results with faster autofocus in a low-light condition or more beautiful night mode portraits based on picture segmentation. This latest chip development is truly setting standards when it comes to improvements of the imager, the driver and processing as well as unprecedented ten metres long-range capabilities at lowest power.”
The volume delivery for this chip starts in Q2 2021 with demo kits are already available from Infineon Technologies.