Friday, March 1, 2024

Compact Bluetooth LE SoC, DA14592 With Low Power Mode

By Shivangi Kharoo

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The device introduces a new low-power mode, achieving 2.3mA radio transmit current at 0dBm and a 1.2mA radio receive current.

Renesas Electronics Corporation  has introduced a Bluetooth Low Energy (LE) System-on-Chip (SoC), DA14592. The SoC stands out as Renesas’ most power-efficient and smallest Bluetooth LE device, featuring a multi-core design with Cortex-M33 and Cortex-M0+ cores. It is specifically designed for applications like connected medical devices, asset tracking, human interface devices, metering, point-of-sale (PoS) readers, and crowd-sourced location (CSL) tracking.

The device introduces a new low-power mode, achieving 2.3mA radio transmit current at 0dBm and a 1.2mA radio receive current. It has minimal hibernation current of 90nA and active current of 34µA/MHz, extending the shelf-life and operational efficiency of products.

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The SoC features a high-precision sigma-delta ADC, up to 32 General purpose input/outputs (GPIOs). It has Quad serial peripheral interface (QSPI) for external memory expansion, distinguishing it from other SoCs in its class.

To streamline Bluetooth LE solutions all necessary external components are integrated into the DA14592MOD module. It ensures rapid time-to-market and lowers overall project costs, improving design flexibility and easy module attachment with castellated pins.

A key application highlighted for the DA14592 and DA14592MOD is ‘Crowd-Sourced’ Locationing. The company is preparing to offer reference designs for this application, focusing on both Android and iOS platforms, particularly with the upcoming Google Find My Device network.

From a cost perspective, the DA14592 requires only 6 external components, significantly reducing the engineering bill of materials (eBOM). It operates with just a system clock and its on-chip RCX, eliminating the need for a sleep mode crystal in most applications. The device has small package size, available in wafer level chip scale package (3.32mm x 2.48mm) and FCQFN (5.1mm x 4.3mm), along with a reduced eBOM, offers an attractively compact solution footprint. 

Using the DA14592MOD also eliminates the need for global regulatory certifications, further reducing development costs and reducing market entry time.

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