HomeMarket VerticalsCommunication & NetworksTiny NFC Tags Now Feature Anti-metallic Interference!

Tiny NFC Tags Now Feature Anti-metallic Interference!

STMicroelectronics and Securitag Assembly Group (SAG) have announced a tiny NFC Ferrite Tag that uses STMicroelectronics’ ST25 NFC tag IC for IoT (Internet of Things) data-transmission applications.

Small, light, and thin, the NFC Ferrite Tag can be surfacemounted during production through the metal pad that can be directly soldered to the PCB surface. In addition, the NFC Ferrite tag can function when placed on metal products because of its anti-metallic interference characteristics.

Chip’s Dimensions are 4.9 x 3.0 x 2.5 mm

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These features make it highly attractive for IoT data-transmission applications in consumer electronics, wearable devices, and smart healthcare products. The tiny NFC Ferrite Tag perfectly suits the need for smaller, thinner, and lighter design for wearable products where compactness is critical. 

Along with its small dimensions (4.9 x 3.0 x 2.5 mm), the NFC Ferrite Tag with an embedded antenna demonstrates outstanding RF performance, benefiting from ST’s state-of-the-art ST25TA02K NFC Forum Type 4 tag IC with built-in NDEF (NFC Data Exchange Format) message support. This allows the NDEF data to be directly executed through an Android NFC phone without any dedicated application software. In addition to NDEF support, the ST25TA02K features a 20-bit counter and 128-bit password to protect read / write access to the 2Kbit EEPROM memory.

Manufacturers will ship as many as 2.2 billion NFC-enabled smartphones by 2020 according to IHS Technology (Market Insight, NFC-enabled Handset Shipments to Reach Three-Quarters of a Billion in 2015, June 2015). The growing momentum for NFC is expected to drive new IoT and wireless applications in the Smart Home, Smart Healthcare/ Medical, Smart City, and Smart Factory. With ST’s global reach and semiconductor leadership, combined with SAG’s professional manufacturing of RFID tags, the two companies aim to accelerate innovation and new product development that strengthens the competitiveness of their customers’ final products.

Dilin Anand
Dilin Anand
Dilin Anand is the Senior Vice President at Electronics For You Group, where he plays a key role in connecting the global engineering ecosystem with India’s rapidly evolving electronics and technology landscape. A core member of the EFY editorial team since 2011, he has been instrumental in shaping content, strategy, and industry engagement across the group’s platforms. With over a decade of experience in technology publishing and ecosystem building, Dilin focuses on bridging the gap between engineers, innovators, and industry stakeholders. His work spans editorial leadership, strategic partnerships, and initiatives aimed at empowering the engineering community with relevant, high-quality knowledge and opportunities. He has also completed the Venture Advancement Program in Entrepreneurship and Entrepreneurial Studies at Massachusetts Institute of Technology, strengthening his perspective on innovation, startups, and technology-driven growth. Dilin is particularly passionate about enabling knowledge exchange, fostering collaboration, and supporting the growth of India’s engineering ecosystem through impactful content and initiatives.

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