These new packages enable large logic functions to be included in small form factor systems for higher system performance
Claiming to be the world’s smallest and low profile packages for logic devices are the 14, 16, 20 and 24 pin packages by Nexperia. With a measurement of just 2 mm x 2 mm (14 pin), 2 mm x 2.4 mm (16 pin), 2 mm x 3.2 mm (20 pin) and 2 mm x 4 mm (24 pin), the 0.4 mm pitch DHXQFN packages are only 0.45 mm high.
For example, the 16 pin DHXQFN package is 45% smaller than the industry-standard DQFN16 leadless device. So not only does it have a small footprint, but the new package also offers a 25% saving in the PCB area.
Parts included in the small form factor include:
- Hex inverting Schmitt-triggers
- 8-bit SIPO shift registers with output latches
- 4-bit dual supply translating transceivers
- Octal buffer/line drivers
- Octal bus transceivers
- 8-bit dual supply translating transceivers
Furthermore, the DHXQFN package’s small footprint enables the logic device’s close placement to the bypass capacitor, which can be advantageous in designs with limited board space. Due to the short traces between the logic device and the capacitor, performance in high-frequency applications increases.
“Previously, incorporating large logic functions into a system with a small form factor was unthinkable. However, our new DHXQFN package enables complex functions such as 74HC595 shift registers to fit into space-sensitive applications like smartwatches, mobile devices and internet-connected industrial devices,” said Ashish Jha, product manager at Nexperia.
