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Wave Soldering Gets Smarter

A next-generation wave soldering system brings higher process control, programmable operation, larger PCB support, and remote monitoring to improve solder quality across electronics manufacturing,...

Edge AI Board Targets Vision

 A new development platform combines high-performance AI processing, large memory capacity, and industrial connectivity, enabling developers to accelerate edge AI, robotics, machine vision, and...

High-Speed Wi-Fi for Connected Devices

Connected devices gain Wi-Fi 7, Bluetooth 6.0, and Zigbee support for streaming, gaming, and multi-device connectivity.  Quectel Wireless Solutions has introduced two tri-band Wi-Fi 7...

Simulation Software Speeds Up Product Design

The software update adds AI tools and simulation features, helping engineers test more designs, find problems earlier, and reduce product development time. Siemens has released...

Capacitors for Battery-Powered Systems

See how these capacitors reduce components, handle more current, and support power systems used in vehicles and industrial equipment. TDK Corporation has expanded its aluminum...

Wireless Module For Smart Home And IoT Devices

A Wi-Fi 6 and Bluetooth module with built-in AI lets smart devices process voice and image tasks locally for faster response and lower latency. Quectel...

Coffee-Infused Filament Brings Sustainability to Everyday 3D Printing

A newly launched coffee-infused printing filament combines recycled coffee grounds with biodegradable plastic, improving sustainability while delivering reliable performance and a distinctive aroma. eSun has...

AI Coding Suite Simplifies Communications

A new developer toolkit integrates AI coding assistants with communication APIs, enabling in-editor application development, simulation, testing, and deployment while reducing dependence on documentation...

Lidar Simplifies Autonomous Vehicle Integration

Can sensor integration speed autonomous vehicle development? A validated lidar platform aims to simplify deployment with AI-driven automotive compute systems. AEye has announced that its...

AI Memory Advancement Targets Inference

A new AI memory infrastructure portfolio combines CXL switching, memory expansion, and near-memory acceleration to overcome inference bottlenecks, improving memory utilisation, scalability, and efficiency...

Controller Boosts Server Memory Capacity 

Can memory become as flexible as compute? A CXL controller is designed to expand capacity while improving resource utilisation for AI servers. Montage Technology has...

Safety Covers Guard Critical Toggle Switches

Can a simple mechanical addition prevent costly switch errors? A spring-loaded design aims to improve safety in demanding control systems. Littelfuse has introduced the C&K...

Adhesive Targets Reliable PCB Reinforcement

Can PCB reinforcement become faster without underfill? A light-curing adhesive aims to improve assembly reliability for compact, high-density electronic designs. Dymax has introduced its 9310...

Driver Amplifier Targets Broadband Defence and Communications Applications Efficiently

A new broadband driver amplifier delivers high gain, strong output power and low distortion across 6–18 GHz for electronic warfare and communications applications. Qorvo has...

Open Source Module Brings Fingerprint Login to Older Macs

An open source USB module delivers fingerprint authentication to compatible Macs, offering a lower-cost alternative while supporting secure logins without replacing existing keyboards. Developer Zimeng...

IR Receiver Supports More Remote Control Codes

An IR receiver module supports multiple remote control signals, reduces components, and improves compatibility across consumer electronic devices. Vishay Intertechnology has introduced the TSOP15300 series...

Smart Amplifier Enhances Voice Clarity

A new stereo smart amplifier combines nonlinear speaker control with adaptive DSP to reduce distortion, improve echo cancellation, and deliver higher audio output for...

SMT Machines Handle Massive Components

New SMT placement capability supports oversized AI server components up to 200 × 200mm and 2kg, addressing evolving packaging requirements for next-generation GPUs, ASICs,...
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