A newly launched coffee-infused printing filament combines recycled coffee grounds with biodegradable plastic, improving sustainability while delivering reliable performance and a distinctive aroma.
eSun has...
A new developer toolkit integrates AI coding assistants with communication APIs, enabling in-editor application development, simulation, testing, and deployment while reducing dependence on documentation...
Can sensor integration speed autonomous vehicle development? A validated lidar platform aims to simplify deployment with AI-driven automotive compute systems.
AEye has announced that its...
A new AI memory infrastructure portfolio combines CXL switching, memory expansion, and near-memory acceleration to overcome inference bottlenecks, improving memory utilisation, scalability, and efficiency...
Can memory become as flexible as compute? A CXL controller is designed to expand capacity while improving resource utilisation for AI servers.
Montage Technology has...
Can a simple mechanical addition prevent costly switch errors? A spring-loaded design aims to improve safety in demanding control systems.
Littelfuse has introduced the C&K...
Can PCB reinforcement become faster without underfill? A light-curing adhesive aims to improve assembly reliability for compact, high-density electronic designs.
Dymax has introduced its 9310...
A new broadband driver amplifier delivers high gain, strong output power and low distortion across 6–18 GHz for electronic warfare and communications applications.
Qorvo has...
An open source USB module delivers fingerprint authentication to compatible Macs, offering a lower-cost alternative while supporting secure logins without replacing existing keyboards.
Developer Zimeng...
An IR receiver module supports multiple remote control signals, reduces components, and improves compatibility across consumer electronic devices.
Vishay Intertechnology has introduced the TSOP15300 series...
A new stereo smart amplifier combines nonlinear speaker control with adaptive DSP to reduce distortion, improve echo cancellation, and deliver higher audio output for...
New SMT placement capability supports oversized AI server components up to 200 × 200mm and 2kg, addressing evolving packaging requirements for next-generation GPUs, ASICs,...
A new terahertz oscillation device quadruples output power while retaining its compact footprint, enabling higher-quality sensing, imaging, and non-destructive testing with lower power consumption...
A portable 3D scanner combines scanning and probing in one system, supporting inspections, larger scan coverage, and quality control in manufacturing.
FARO Creaform has launched...
A new low-power wireless module combines Wi-Fi 6, Bluetooth Low Energy and integrated processing to simplify connected device development across industrial and consumer applications.
NXP...
Can flash memory help overcome AI's growing memory bottleneck? An open standard is redefining data movement between memory and storage.
SK hynix has unveiled the...
Can packaging unlock the next leap in AI chips? Advanced interconnect technologies are pushing semiconductor integration beyond reticle limits.
Intel Foundry has highlighted its advanced...
A new range of rugged industrial Ethernet switches combines Layer 3 networking, PoE++, 10G uplinks, and hardened designs to deliver reliable connectivity for automation,...