The cleaners remove residue in electronics manufacturing, working with both automatic and manual systems, and are approved by top manufacturers.
With the introduction of Etimol...
With its unique combination of high accuracy, durability, and real-time feedback, it represents a leap forward in sensor technology—offering industries a smarter, more efficient...
Saves board space with optional NTC thermistor and pre-applied PC-TIM and ideal for automotive, industrial, and AMS applications, it handles high energy pulses and...
The SiC modules combine key power circuits in one package, cutting heat, saving space, and boosting performance in electric vehicle and industrial power systems.
ROHM...
The four drones offer surveillance, attack, and navigation features, built to boost security and promote local manufacturing.
To strengthen India’s defense capabilities and support the...
The micro speaker for wireless earbuds delivers clear sound without an amplifier, uses less power, lowers cost, and fits easily into any design.
xMEMS Labs,...
Offering low power consumption, broad temperature tolerance, and integrated features for consumer, industrial, and building automation systems.
Renesas Electronics Corporation has announced the release of...
New gate driver delivers 1.9 A source and 2.3 A sink output, offering robust performance and improved switching efficiency for demanding power systems.
Littelfuse, Inc. has introduced...
The chip platform brings Wi-Fi 6, Bluetooth 6.0, multi-protocol support, Edge AI, and security to smart homes, healthcare, industry, and automation.
InnoPhase IoT has introduced...
Offering superior low-light performance, compact size, and integrated image processing—all in a cost-effective package tailored for next-generation in-vehicle safety systems.
OMNIVISION has introduced the OX01N1B,...
The world’s smallest PPG sensor head fits in tight spaces, enables health tracking, supports multiple uses, and cuts costs with a compact, low-cost design.
SCIVAX...
The series of wireless SoCs delivers performance, memory, and security for Bluetooth LE devices like wearables and medical sensors.
Silicon Labs has announced its new...
The first 12-layer HBM4 samples shipped early, offering 2TB/s speed, 36GB capacity, improved heat control, and faster AI memory performance for future use.
SK hynix...
Rugged durability, SFF-friendly designs, or compact dual-fan options, these new GPUs are engineered for peak performance and seamless customization with intuitive monitoring and overclocking...
The module breaks the 23dBm limit with up to 30dBm power, boosting LTE-M and NB-IoT range for private networks, smart grids, and industrial IoT.
Ubiik...
The first optical I/O chiplet with UCIe interface delivers 8 Tbps bandwidth to reduce latency, lower power use, and scale AI with chiplet interoperability.
Ayar...
The FPGA combines HBM with DDR5 and LPDDR5 support, enabling memory bandwidth and efficiency for AI, networking, video processing, and test equipment applications.
Altera Corporation...