Texas Instruments (TI) has announced a new portfolio of solid-state relays. The portfolio includes TPSI3050-Q1, an isolated switch driver with an integrated 10-V gate...
Onsemi has unveiled NTBL045N065SC1, the world’s first TO-Leadless (TOLL) packaged 650V Silicon Carbide (SiC) MOSFET. The MOSFET comes in a compact package and offers...
Nordson Electronics Solutions has recently introduced FS-EP1, a system solution for dispensing single-component thermal interface materials (TIMs). The system is developed by integrating the...
The Cornell Dubilier Electronics’ (CDE) has announced the expansion of its signature 380LX and 381LX aluminium electrolytic capacitor series. The new capacitors are rated...
ROHM has added new MOSFETs to its existing PrestoMOS lineup of 600V Super Junction MOSFETs. The R60xxVNx series provides a low on-resistance along with...
Analog Devices, Inc. has announced the release of ADXL367, a MEMS Accelerometer. The three-axis MEMS accelerometer is designed for healthcare and industrial applications and...
Test Research, Inc. (TRI) has announced the release of TR7500QE Plus, a Multi-Camera 3D Automatic Optical Inspection (AOI) solution. The metrology-grade 3D AOI solution...
LEMO has added new High-Power connectors with gold-plated contacts to its existing range of M series connector portfolios. The new connectors offer robust, light...
Teledyne FLIR has announced the release of Hadron 640R, a high-performance, Dual thermal and OEM camera module. The 64MegaPixel camera combines a radiometric thermal...
Emil Otto GmbH and Feinhütte Halsbrücke GmbH have released new flux-filled high-performance solder wires. These micro-alloyed solders are said to significantly reduce copper leaching...
Omni Pro Electronics has announced the release of NAZR Series of surface mount High-CV Aluminum Electrolytic Capacitors. The series supports power electronics applications of...
iWave Systems launches a Solderable System on Module based on the NXP i.MX 8XLite applications processor
iWave Systems systems have released iW-RainboW-G46M, the solderable i.MX8XLite...
Rohde & Schwarz’s ipoque GmbH has announced the launch of R&SvPACE, a vector packet processing (VPP)-native deep packet inspection (DPI) engine designed specifically to...
Hitachi High-Tech Analytical Science has announced the addition of FT230 to its plating and coatings analysis range. The FT230 is designed to have simple...